A research team led by Dr. Hyun-Ae Cha from the Korea Institute of Materials Science (KIMS) has developed a cutting-edge composite material that combines environmental sustainability with efficient heat dissipation. Using a protein foaming process based on egg whites, the team created a three-dimensional magnesium oxide (MgO) structure that enhances thermal conductivity significantly. This innovative material exhibits thermal conductivity up to 2.6 times higher than traditional heat-dissipating composites.
As electronic devices become more advanced and compact, the heat they generate continues to rise, making effective thermal management increasingly critical. In electric vehicles (EVs), for instance, inadequate cooling of the battery can lead to performance issues, and in extreme cases, fires or explosions. The key to addressing these challenges is the Thermal Interface Material (TIM), which is essential for effective heat dissipation.
Conventional TIMs typically involve mixing thermally conductive fillers into a polymer matrix. This method often results in randomly dispersed fillers, which disrupt thermal pathways and hinder overall performance. Increasing the filler content may boost thermal conductivity, but it also leads to challenges in processing and higher costs, making scalability a concern.
To overcome these obstacles, the research team employed an innovative protein foaming method. This technique allows for a dense and uniform interconnection of particles. By using the property of egg-white proteins that expand at high temperatures, the team formed a three-dimensional interconnected network of particles. This advancement created a composite material with continuous thermal pathways, ensuring uninterrupted heat transfer.
The resulting TIM achieved a remarkable thermal conductivity of 17.19 W/m·K, showcasing exceptional heat dissipation capabilities. Notably, despite utilizing magnesium oxide—a lightweight and cost-effective material—this composite outperformed commonly used aluminum oxide (Al2O3) and nitride-based heat-dissipating materials.
Integration with epoxy resin, a polymer used to enhance adhesion with thermal fillers, further improved the material’s practical applicability. This technology holds promise for enhancing the performance and stability of high-heat-generating devices, including electronics, semiconductor packages, EV batteries, 5G communication devices, and high-performance servers.
The domestic market for TIMs in South Korea is estimated to exceed KRW 200 billion annually, with a significant reliance on imports. The commercialization of this new technology could provide a substantial boost to South Korea’s technological self-reliance in thermal management materials.
Dr. Hyun-Ae Cha remarked, “Through the protein foaming–based process, we can produce high–thermal–conductivity materials in an eco-friendly and cost-effective way.” She added, “This study serves as a strong example demonstrating the feasibility of developing lightweight, high-performance heat-dissipating materials.”
The research, funded by the National Research Foundation of Korea (NRF), was published on May 28, 2023, in the esteemed journal Advanced Science (Impact Factor: 15.1) and was featured as the cover article for Volume 12, Issue 33.
Korea Institute of Materials Science (KIMS) is a government-funded research institute under the Ministry of Science and ICT of the Republic of Korea. As the only institute specializing in comprehensive materials technologies in the country, KIMS conducts extensive research, development, inspection, and technology support related to materials science, contributing significantly to the Korean industry.
